Microstructure characterization of porous microalloyed aluminium-silicate ceramics
نویسندگان
چکیده
منابع مشابه
Characterization of porous silicate for ultra-low k dielectric application
Thermal stability of a porous low-k film is a critical issue for application consideration in the back-end-of-line. In this study, thermal stability of the porous silicate has been investigated by changing the thermal processing temperatures. Experimental results have shown that the dielectric constant of the porous silicate still remains below 2.0 after thermal processing at 500 8C for 1 h. A ...
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ژورنال
عنوان ژورنال: Journal of Mining and Metallurgy, Section B: Metallurgy
سال: 2011
ISSN: 1450-5339,2217-7175
DOI: 10.2298/jmmb110331011p